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IR20153S & (PbF)
1200
1000
800
600
400
-50
0
50
100
150
Temperature ( o C)
Figure 20. Recharge Gate Turn-off to High Side
Turn-on vs. Tem perature, VBS=7V
Case outline
A
D
5
B
FOOTPRINT
DIM
A
INCHES
MIN MAX
.0532 .0688
MILLIMETERS
MIN MAX
1.35 1.75
8X 0.72 [.028]
A1 .0040
b .013
.0098
.020
0.10
0.33
0.25
0.51
E
6
8
1
7
2
6
3
5
4
H
0.25 [.010]
A
6.46 [.255]
c
D
E
e
.0075 .0098
.189 .1968
.1497 .1574
.050 BASIC
0.19 0.25
4.80 5.00
3.80 4.00
1.27 BASIC
e1
.025 BASIC
0.635 BASIC
H
K
.2284
.0099
.2440
.0196
5.80
0.25
6.20
0.50
6X
e
3X 1.27 [.050]
8X 1.78 [.070]
L
y
.016
0°
.050
8°
0.40
0°
1.27
8°
e1
A
C
y
K x 45°
8X b
0.25 [.010]
A1
C A B
0.10 [.004]
8X L
7
8X c
NOTES:
1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.
5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].
2. CONTROLLING DIMENSION: MILLIMETER
3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
4. OUTLINE C ONFORMS TO JEDEC OUTLINE MS-012AA.
6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].
7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO
A SUBSTRATE.
01-6027
14
8-Lead SOIC
01-0021 11 (MS-012AA)
www.irf.com
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